Things You'll Need
Instructions
Place the substrate onto the spin-coater chuck. Using a pipette, place enough SU8 2002 resist onto the substrate to completely cover it. Program the spin-coater to spin at 500 rpm for 10 seconds and then 2000 rpm for 30 seconds. The manufacturer specification sheet states that this should lead to a resist thickness of 2.4 microns.
Remove the sample from the spin-coater and place it on a hot plate set to 95 degrees Celsius or 203 degrees Fahrenheit. Leave the sample on the hot plate for two minutes. Remove sample and allow to cool for five minutes.
Place the photo-mask into the mask aligner. Place the sample under the mask. Expose the sample. Remove the sample from the mask aligner and place it into a beaker of developer for one minute. After development, rinse sample in Isopropyl alcohol. The sample will now consist of a series of patterned pits, which copper can be deposited into to finish the PCB.
Place a pellet of copper into the evaporation chamber crucible. Pump down the evaporation chamber to a pressure of about 10^-6 mbar or 10^-4 Pascals. Deposit the desired thickness of copper. Remove the sample from the evaporator. Place the sample into a beaker of acetone. This removes the remaining SU8 resist, and leaves the copper tracks. Rinse the sample in a beaker of IPA. The PCB is complete